Signal trasmission through lc resonant circuits

ABSTRACT

An embodiment of an electronic system includes a first electronic circuit and a second electronic circuit. The electronic system further includes a resonant LC circuit having a resonance frequency for coupling the first electronic circuit and the second electronic circuit; each electronic circuit includes functional means for providing a signal at the resonance frequency to be transmitted to the other electronic circuit through the LC circuit and/or for receiving the signal from the other electronic circuit. The LC circuit also include capacitor means having at least one first capacitor plate included in the first electronic circuit and at least one second capacitor plate included in the second electronic circuit. The LC circuit further includes first inductor means included in the first electronic circuit and/or second inductor means included in the second electronic circuit. The at least one capacitor plate of each electronic circuit is coupled with the corresponding functional means through the possible corresponding inductor means.

PRIORITY CLAIM

The instant application claims priority to Italian Patent ApplicationNo. MI2009A001825, filed Oct. 21, 2009, which application isincorporated herein by reference in its entirety.

RELATED APPLICATION DATA

This application is related to U.S. patent application Ser. No. ______,entitled TESTING OF ELECTRONIC DEVICES THROUGH CAPACITIVE INTERFACE(Attorney Docket No.: 2110-350-03) filed ______, and which isincorporated herein by reference in its entirety.

TECHNICAL FIELD

One or more embodiments generally relate to the field of electronics.More specifically, such embodiments relate to the field of wirelesstransmission of signals and/or power among electronic circuits.

BACKGROUND

An electronic system may be formed by a plurality of electroniccircuits, each one being capable of performing a specific function ofthe system. Among the design issues that are encountered in thedevelopment of an electronic system, one of particular relevance isgiven by the coupling among the electronic circuits thereof.

In a solution being known in the state of the art and commonly used fora large number of electronic systems available in the market, thecoupling among the electronic circuits is performed through electricalconnections. For example, such electrical connections may be implementedby interconnection metal tracks being arranged on an insulating supportthat is shared among the electronic circuits.

However, such interconnection tracks are subject to parasitic effects(for example, resistive, inductive and capacitive ones) that limit themaximum frequency of the signals (thereby affecting the speed ofcommunication and execution of the operations) and that may implyunwanted power dissipation.

A known solution of the above-mentioned drawbacks provides for thecoupling among the electronic circuits through electromagnetic waves. Inorder to transmit and/or receive the desired signals, the electroniccircuits are provided with antennas. There exist solutions in which theantennas are of capacitive type; such capacitive antennas are devicesthat mainly use the electric field and, by means of electric induction,translate a voltage variation into an electromagnetic disturbance, andvice-versa, depending on whether they are used for transmission orreception. However, the capacitive antennas may be capable of onlytransmitting and receiving signals, but not a power supply. There alsoexist opposite solutions in which the antennas are of inductive type andthey are included, for example, in parallel resonant LC circuits (thatis, formed by an inductor and a capacitor being connected in parallel).Such inductive antennas mainly use the magnetic field and they aredevices that, by means of magnetic induction, translate a currentvariation into an electromagnetic disturbance, and vice-versa, dependingon whether they are used for transmission or reception.

However, such solutions may have some drawbacks that make them notalways conveniently applicable in any electronic system. Particularly,the use of resonant LC circuits (for example, of parallel type) beingembedded in the electronic circuits may occupy an excessive area, andthis is often incompatible with the needs of reduced size.

Such drawback may be solved by implementing each inductive antenna in anupper area of the electronic circuit (without any increase in the areaoccupation of the electronic circuit). However, both in the case thatthe antenna is formed within the electronic circuit and in the case thatthe antenna is formed above it, the implementation of the coupling beingbased on inductive antennas substantially requires that each electroniccircuit being part of the electronic system should be provided with atleast one resonant LC circuit. This implies an increase in the number ofrequired components and in the production costs.

SUMMARY

In its general terms, an embodiment is based on the idea of distributingthe resonant LC circuits across different circuits.

More specifically, an embodiment is an electronic system including afirst electronic circuit and a second electronic circuit. The electronicsystem further includes a resonant LC circuit having a resonancefrequency for coupling the first electronic circuit and the secondelectronic circuit; each electronic circuit includes functional meansfor providing a signal at the resonance frequency to be transmitted tothe other electronic circuit through the LC circuit and/or for receivingthe signal from the other electronic circuit. An embodiment, the LCcircuit includes capacitor means having at least one first capacitorplate included in the first electronic circuit and at least one secondcapacitor plate included in the second electronic circuit. The LCcircuit further includes first inductor means included in the firstelectronic circuit and/or second inductor means included in the secondelectronic circuit. The at least one capacitor plate of each electroniccircuit is coupled with the corresponding functional means through thepossible corresponding inductor means.

Another embodiment is a corresponding transmission method.

The same features being recited in the dependent claims for theelectronic system may apply mutatis mutandis to the method.

A further embodiment is an electronic circuit for use in such electronicsystem.

A different embodiment is a complex apparatus including one or more ofsuch electronic systems.

BRIEF DESCRIPTION OF THE DRAWINGS

One or more embodiments, as well as further features and the advantagesthereof, may be best understood with reference to the following detaileddescription, given purely by way of a non-restrictive indication, to beread in conjunction with the accompanying drawings (whereincorresponding elements are denoted with equal to similar references, andtheir explanation is not repeated for the sake of exposition brevity).In this respect, it is expressly intended that the figures are notnecessarily drawn to scale and that, unless otherwise indicated, theyare simply used to conceptually illustrate the described structures andprocedures. In particular:

FIG. 1A schematically shows an electronic system according to anembodiment,

FIG. 1B schematically shows an electronic system according to anotherembodiment,

FIG. 2A-2E schematically show different implementations of an electroniccircuit according to corresponding embodiments,

FIG. 2F schematically shows two electronic circuits in cross-sectionaccording to another embodiment,

FIG. 3A schematically shows different implementations of an electroniccircuit in top view according to corresponding embodiments,

FIG. 3B schematically shows an implementation of an electronic circuitin cross-section according to another embodiment,

FIG. 4A schematically shows an electronic system according to anotherembodiment,

FIG. 4B schematically shows an electronic system according to a furtherembodiment,

FIG. 5A schematically shows an implementation of the electronic systemof FIG. 4A according to an embodiment, and

FIG. 5B schematically shows an implementation of the electronic systemof FIG. 4A according to another embodiment.

DETAILED DESCRIPTION

In particular, in FIG. 1A there is schematically shown an electronicsystem 100 a exploiting wireless signal transmission according to anembodiment.

The electronic system 100 a may include a plurality of electroniccircuits; for the sake of description simplicity, there are considered,by way of example in no way limitative, a first electronic circuit 105 aand a second electronic circuit 105 a′ of the electronic system 100 a.

Each electronic circuit 105 a, 105 a′ includes a correspondingfunctional region 108 a, 108 a′; the functional region 108 a, 108 a′ isformed by circuit elements (not shown in the figure) implementingspecific functions of the electronic circuit 105 a, 105 a′ and by atransmission and/or reception block (for example, a transceiver, oralternatively a transponder) 110 a, 110 a′ for managing signaltransmissions and/or reception between the electronic circuits 105 a and105 a′, and vice-versa.

Such signals may be operative signals, which are used for transmitting acorresponding information content (for example, being properly encodedand modulated onto a carrier wave by any known communication technique).

In addition or in alternative, such signals may be supply signals, whichconsist of an alternate carrier wave that may be used for transmittingenergy capable of supplying another system—for example, being used inreception for creating a direct voltage through an AC/DC converterperforming an operation of rectification, filtering, and possibleregulation.

Each transceiver 110 a, 110 a′ is provided with input/output terminals103 a, 103 a′ for receiving and/or transmitting such signals, and with areference terminal 104 a, 104 a′ for receiving a reference voltage. Forexample, the reference voltage may be a ground voltage (0 V), which maybe provided through wired lines within all the electronic circuits ofthe electronic system 100 a (as represented in the figure through linesbeing connected to the electrical symbol of the ground).

A metal plate 120 a is formed in an area 130 being outside thefunctional region 108 a of the electronic circuit 105 a, while anothermetal plate 120 a′ is formed in an area 130′ being outside thefunctional region 108 a′ of the electronic circuit 105 a′.

Such metal plates 120 a and 120 a′ are arranged in parallel being facingto each other at a suitable distance, so as to form a capacitor 123 ahaving as dielectric medium, for example, the air being interposedbetween the electronic circuits 105 a, 105 a′ (beyond any insulatingprotection layers thereof).

In the described exemplary embodiment, the area 130 of the electroniccircuit 105 a also includes an inductor 125 a; the inductor 125 a has afirst terminal being coupled to a terminal 103 a of the transceiver 110a and a second terminal being coupled with the metal plate 120 a.

The metal plate 120 a′ of the electronic circuit 105 a′, instead, isdirectly coupled with the terminals 103 a′ of the transceiver 110 a′.

In this way, the inductor 125 a and the capacitor 123 a form a seriesresonant LC circuit 125 a, 123 a; such LC circuit 125 a, 123 a has aresonance frequency (whose value depends on the size of the inductor 125a and of the capacitor 123 a) at which ideally it behaves like a shortcircuit, so that each signal at the resonance frequency may betransmitted through it (from the transceiver 110 a of the electroniccircuit 105 a to the transceiver 110 a′ of the electronic circuit 105a′, and vice-versa), ideally without any loss.

An embodiment is advantageous since it does not require that eachelectronic circuit 105 a, 105 a′ should be provided with a wholeresonant LC circuit, with considerable saving in area occupation.

In fact, the corresponding inductor may be present in only one of theelectronic circuits 105 a, 105 a′ (such as for the inductor 125 a of theelectronic circuit 105 a in the example at issue).

In any case, the capacitor 123 a is distributed on the two electroniccircuits 105 a, 105 a′; in particular, each electronic circuit 105 a,105 a′ includes one plate 120 a, 120 a′ only of such capacitor 123 a,while the respective dielectric medium is formed outside the electroniccircuit 105 a, 105 a′ (for example, through the air being interposedbetween them).

All of this may have a beneficial effect on the size of the electroniccircuits 105 a, 105 a′, and hence of the whole electronic system 100 a.

In FIG. 1B there is schematically shown an electronic system 100 bexploiting wireless signal transmission according to another embodiment.

The electronic system 100 b includes two electronic circuits 105 b and105 b′ comprising the same components described above.

In such embodiment, in the area 130 of the electronic circuit 105 bthere is formed a further metal plate 120 b, and in the area 130′ of theelectronic circuit 105 b′ there is formed a further metal plate 120 b′,which two plates form a further capacitor 123 b.

The area 130 of the electronic circuit 105 b includes a further inductor125 b; the inductor 125 b has a first terminal being coupled with thereference terminal 104 a of the transceiver 110 a and a second terminalbeing coupled with the metal plate 120 b.

The metal plate 120 b′, instead, is directly connected to the referenceterminal 104 a′ of the transceiver 110 a′ of the electronic circuit 105b′.

As above, the inductor 125 b and the capacitor 123 b form a furtherseries resonant LC circuit 125 b, 123 b.

The configuration thus obtained allows implementing a differentialtransmission of the signals between the electronic circuit 105 b (at theterminals 103 a and 104 a) and the electronic circuit 105 b′ (at theterminals 103 a′ and 104 a′).

The implementations being depicted in FIG. 1A-1B may also benefit ofmanufacturing improvements for allowing an optimal management of thearea occupation of the electronic circuits within the correspondingelectronic system; for example, the inductors 125 a, 125 b may bedistributed at least partly on several circuits.

FIG. 2A-2E schematically show electronic circuits with differentimplementations of the corresponding metal plates according tocorresponding embodiments.

With particular reference to FIG. 2A, an electronic circuit 205 aincludes a functional substrate 206 being formed on a semiconductorsubstrate 215; the functional substrate 206 includes a plurality ofactive areas (not shown in the figure) being adapted to carry outspecific functions of the electronic circuit 205 a, and metal layers(not shown in the figure) for electrically connecting such active areas.

A passivation layer 207 is formed on the functional substrate 206 forpreserving it from corrosion, contamination and actions of externalsubstances.

The passivation layer 207, however, does not completely cover a lastmetal layer; the portions of the last metal layer being not covered bythe passivation layer 207 form pads 220 a (only one shown in the figureas a dark rectangle) for coupling the functional substrate 206 of theelectronic circuit 205 a with other electronic devices (not shown in thefigure).

An embodiment provides that the pad 220 a is used directly as metalplate.

Moreover, on the metal plate 220 a there may be formed a layer ofdielectric material 222 a; in this way, it is possible to increase thevalue of the capacity of the corresponding capacitor (being obtained byapproaching the other metal plate, not shown in the figure, to the layerof dielectric material 222 a).

An embodiment is advantageous since it allows minimizing the additionaloperation being required for achieving the desired result.

Turning now to FIG. 2B, an electronic circuit 205 b has a similarstructure to that shown in FIG. 2A.

In this case, a pad 210 is used for contacting the metal plate, which isformed by a substantially rectangular layer of metallic material 220 bbeing deposited on the pad 210 and on a portion of the passivation layer207 around the pad 210.

In this embodiment as well, it is possible to form a layer of dielectricmaterial 222 b on the metal plate 220 b (obtaining the same or a similaradvantage as described above).

An embodiment is advantageous since it is possible to increase thesurface of the metal plate 220 b, and thus the capacity of thecapacitor, by using a pad 210 having reduced area.

With reference now to FIG. 2C, an electronic circuit 205 c has a similarstructure to that shown in FIG. 2B (omitting the layer of dielectricmaterial for the sake of simplicity), with the difference that a metalplate 220 c having a herringbone structure (also called interdigitated)is formed on the pad 210 and on a portion of the passivation layer 207.

An example of part of the interdigitated structure of the metal plate220 c is shown in plan view in FIG. 2C below.

The metal plate 220 c includes a longitudinal metal strip 225 c;transversal metal strips 230 c extend perpendicularly to the metal strip225 c (for example, at an equal distance at their sides); one of suchtransversal metal strips having a greater width (being differentiatedthrough the reference 230 c′) contacts the pad 210.

An embodiment is advantageous since it allows using the metal plate 220c as a further means for wireless signal transmission; in fact, inparticular conditions of charge migration within the metal plate 220 c,this behaves as a set of Hertzian dipole antennas.

With reference now to FIG. 2D, an electronic circuit 205 d again has asimilar structure to that shown in FIG. 2B (omitting the layer ofdielectric material for the sake of simplicity), with the differencethat after having deposited the passivation layer 207, this is processedso as to remove it selectively (for example, through an etching process)in order to form a series of holes 240 d (that leave exposed portions ofan oxide layer, not shown in the figure, being placed on a surface areaof the functional substrate 206).

Then, a metal plate 220 d is formed on the pad 210, on a portion of thepassivation layer 207 d around the pad 210 (including the holes 240 d)and on the portions of the oxide layer being exposed in such holes 240d, so as to obtain a non-planar structure (with depressions incorrespondence to the holes 240 d, which may also extend partly withinthe functional substrate 206).

An embodiment is advantageous since the shaped profile of the metalplate 220 d allows implementing capacitors with capacity of higher valuewith respect to the previous embodiments, since this increases the areaof the metal plate 220 d but maintaining limited its encumbrance (andthus the size of the whole electronic circuit) in terms of occupiedsurface area.

Turning now to FIG. 2E, an electronic circuit 205 e again has a similarstructure to that shown in FIG. 2B, with the difference that the layerof dielectric material being formed on the metal plate 220 b (indicatedby the reference 222 e) is now provided with metal particles 250 e (onlyfour shown in the figure), each one including positive charges (blackregion) and negative charges (white region).

When a voltage is applied to the metal plate 220 b (by the signal to betransmitted), the layer of dielectric material 222 e is subject to acorresponding electric field. By electric induction, such electric fieldrotates the positive and the negative charges of each metal particle 250e along the direction of the electric field; this creates a pseudo-metalplate in addition to the metal plate 220 b (which thus may also beomitted, with the layer of dielectric material 222 e being in directcontact with the pad 210). Moreover, with high densities of theparticles 250 e, metal “bridges” (between the metal plates) within thelayer of dielectric material 222 e may possibly be formed.

An embodiment is advantageous since the properties of signaltransmission may be improved by the metal bridges; in particular, insuch way it may also be possible to transmit direct signals, such as asupply voltage of the electronic system. Moreover, the presence of theparticles 250 e may allow compensating a possible misalignment betweenthe metal plate 220 b and the other metal plate (not shown in thefigure) being placed on the layer of dielectric material 222 e.

FIG. 2F schematically shows two electronic circuits (indicated by thereferences 205 f, 205 f′) in cross-section with an implementation of themetal plates according to another embodiment. The electronic circuit 205f again has a similar structure to that shown in FIG. 2B, with thedifference that the metal plate and the corresponding layer ofdielectric material (indicated by the references 220 f and 222 f,respectively) have a shape that is complementary to a shape of the othermetal plate and the corresponding layer of dielectric material of theelectronic circuit 205 f′ (indicated with the references 220 f′ and 222f′, respectively

In the example in FIG. 2F, the metal plate 220 f and the layer ofdielectric material 222 f of the electronic circuit 205 f have a convextrapezoidal shape; such shape may be obtained from the structure beingdepicted in FIG. 2B by smoothing out the metal plate 220 b through aknown technique of chemical etching or by forming a bump according toany known technique. The concave trapezoidal structure is obtained byfirstly forming a groove in a functional substrate 206′ (which is madeon a semiconductor substrate 215′ and it is covered by a passivationlayer 207′), then forming a metal plate 220 f′ within the same groove,and finally depositing the layer of dielectric material 222 f′ onto themetal plate 220 f′.

It is noted that the concave shape of the metal plate 220 f′ and of thelayer of dielectric material 222 f′ is formed within the functionalsubstrate 206′; in this way, a reduction of the encumbrance of theelectronic circuit 205 f′ is obtained at the expense of a reduction inthe working volume of its functional substrate 206′, wherein theconnections between the active and/or passive components may be made. Inan alternative embodiment (not shown in the figure), the concavetrapezoidal shape may be formed outside the functional substrate throughdeposition of a metal layer and subsequent etching thereof with thefinal deposition of the layer of dielectric material. In this secondcase, it is obtained a greater encumbrance of the electronic circuitwithout affecting the working volume of its functional substrate.

An embodiment is advantageous since, by exploiting mechanicallyself-centering metal plates, it allows avoiding misalignments betweensuch metal plates that might cause undesired changes of the capacity andhence of the resonance frequency of the resonant LC circuit.

The embodiments being described from FIG. 2A to FIG. 2F do not cover allthe possible implementations, because they are only exemplary and notlimitative embodiments. Moreover, is understood that such embodimentsmay be combined with each other, providing further implementations thathowever fall within the scope of the present disclosure.

Referring now to FIG. 3A, there are schematically shown differentimplementations of the metal plate and of the inductor of the resonantLC circuit in top view according to corresponding embodiments. Theelectronic circuits have a structure being substantially equivalent tothat shown in FIG. 2B, with the difference that both the metal plate andthe inductor (not visible in the figure) are formed on the passivationlayer. What differentiates the three embodiments represented in FIG. 3Ais the mutual arrangement of the metal plate and of the inductor (beingformed by a winding having a proper number of coils). In a firstembodiment of the electronic circuit being indicated with the reference305 a ₁, a metal plate 320 a ₁ and an inductor 325 a ₁ are put side byside. In a second embodiment of the electronic circuit being indicatedwith the reference 305 a ₂, a metal plate 320 a ₂ is around an inductor325 a ₂ (that is, outside its winding). In a third embodiment of theelectronic circuit being indicated with the reference 305 a ₃, a metalplate 320 a ₃ is both around an inductor 325 a ₃ and within it; inaddition, the metal plate 320 a ₃ is shaped like a coil of the inductor325 a ₃. In any case, such shaping may also be used for the metal plate320 a ₂ of the second embodiment.

The embodiment of the electronic circuit 305 a ₁ may be usefullyimplemented by using standard production processes; therefore, suchembodiment may be used for making electronic devices having reducedcosts.

The embodiments of the electronic devices 305 a ₂ and 305 a ₃ may beusefully exploited for avoiding unwanted coupling between neighboringelectronic circuits; in fact, the metal plate 320 a ₂, 320 a ₃ aroundthe inductor 325 a ₂, 325 a ₃ may cause an effect of segregation of itsmagnetic field.

In addition, the embodiment of the electronic circuit 305 a ₃ takes fulladvantage of the available area, so as to obtain capacitors with highercapacity for the same area occupation, or to reduce the area occupationfor the same capacity (thanks to the portion of the metal plate 320 a ₃within the inductor 325 a ₃.

Turning to FIG. 3B, there is schematically shown an embodiment of theelectronic circuit in cross-section (indicated by the reference 305 b)with an implementation of the metal plate and of the inductor (indicatedwith the references 320 b and 325 b, respectively) according to anotherembodiment. The electronic circuit 305 b, having substantially the samestructure as that shown in FIG. 2B, has the metal plate 320 b beingformed on a passivation layer 307; such metal plate 320 b is connectedto a pad 310 being connected to an inductor 325 b, which is formedwithin the functional substrate 306 being located above thesemiconductor substrate 315.

In such an embodiment the inductor 325 b may affect the size of theelectronic circuit 305 b, but this may be reduced by increasing thevalue of the inductance of the inductor 325 b by using, for example,magnetic vias 330 b within a winding forming the inductor 325 b.

FIG. 4A schematically shows an electronic system 400 a according toanother embodiment. The electronic system 400 a includes theabove-described electronic circuit 105 a (see FIG. 1A) and anotherelectronic circuit 405 a having substantially the same structure (whosecomponents are indicated with the same references but replacing thefirst digit 1 with the digit 4).

In the electronic system 400 a the metal plates 120 a and 420 a of theelectronic circuits 105 a and 405 a, respectively, are arranged inparallel facing each other, as well as the respective inductors 125 aand 425 a. In this way, the signal transmission between the twoelectronic circuits 105 a and 405 a may occur through the resonantchannel being created by the virtual short circuit that is createdbetween the two metal plates 120 a and 420 a and, at the same time,through the magnetic coupling that, by electromagnetic induction, existsbetween the inductors 125 a and 425 a.

An embodiment of exploiting both a capacitive transmission and aninductive transmission may be advantageous since the signal detected bythe transceivers 110 a, 410 a turns out to have an amplitude beinggreater with respect to the case of the capacitive transmission only;this may lead to a good signal to noise ratio in the phase ofacquisition and subsequent processing of the signals.

FIG. 4B schematically shows an electronic system 400 b according to afurther embodiment. The electronic system 400 b includes theabove-described electronic circuits 105 a and 105 a′ and a furtherelectronic circuit 405 b. The electronic circuit 405 b includes, asabove, a functional region 408 b, a transceiver 410 b, and terminals 403b, 404 b, with the difference that in an area 430 outside the functionalregion 408 b there is formed an inductor 425 b (instead of a metalplate) being coupled between the terminals 403 b and 404 b of thetransceiver 410 b.

With an embodiment, the electronic circuit 105 a may transmit signalssimultaneously to the electronic circuit 105 a′ (by capacitivetransmission through the resonant channel between the respective metalplates 120 a and 120 a′) and to the electronic circuit 405 b (byinductive transmission because of electromagnetic induction between therespective inductors 125 a and 425 b), and vice-versa.

Such embodiment may be particularly advantageous since it allows thesimultaneous transmission of signals among multiple circuits of the sameelectronic system in different modes. Moreover, further advantages maybe obtained by implementing the embodiments being shown in FIG. 4A andFIG. 4B in differential configuration as described for FIG. 1B.

With reference to FIG. 5A, there is schematically shown animplementation of the electronic system 400 a according to anembodiment. In such case, the electronic circuits (indicated with thereferences 505 a and 505 a′) have different sizes. Each electroniccircuit 505 a, 505 a′ includes a semiconductor substrate 515 a, 515 a′on which a functional substrate 506 a, 506 a′ is placed; on thefunctional substrate 506 a, 506 a′ there is deposited a passivationlayer 507 a, 507 a′ in which a pad 510, 510′ is formed. On thepassivation layer 507 a, 507 a′ of each electronic circuit 505 a, 505 a′there are formed a metal plate 520 a, 520 a′ and an inductor 525 a, 525a′ around it. The electronic circuits 505 a, 505 a′ are placed inface-to-face configuration, in which the metal plate 520 a and theinductor 525 a of the electronic circuit 505 a are arranged frontallyand parallel to the metal plate 520 a′ and to the inductor 525 a′ of theelectronic circuit 505 a′, respectively.

The area included between the passivation layers 507 a and 507 a′ of theelectronic circuits 505 a and 505 a′ may be filled with dielectricmaterial 522 a for increasing the capacitive coupling. The pads 510 a ofthe electronic circuit 510 a and the pads 510 a′ of the electroniccircuit 505 a′ may be connected to external circuits or to each other byusing wires (wire bonds in jargon) or contact bumps.

It may also be possible to have the electronic circuit 505 a and theelectronic circuit 505 a′ in a configuration known as face-to-back (notshown in the figure), which differs from the face-to-face configurationbecause in one of the two electronic circuits the capacitive plate andthe inductor are made under the semiconductor substrate. In this case itmay be necessary to use at least one metal via (in jargon, ThroughSilicon Via, or TSV) for connecting the capacitive plate and theinductor to the functional substrate by passing through thesemiconductor substrate.

Also other configurations not shown in any figure may be implemented,such as, for example, the back-to-back and back-to-face configurations,even in the differential configuration; moreover, the metal plate may bepresent above the passivation layer and the inductor may be presentunder the semiconductor substrate (or vice-versa), and they may beconnected to each other through TSVs. Possibly, one of the surfaces ofthe TSV itself may be used as a capacitor plate.

Referring now to FIG. 5B, there is schematically shown an implementationof the electronic system 400 a according to another embodiment. In suchcase, two electronic circuits 505 b, 505 b′ are implemented in insulatedareas of a common functional substrate 506 b, being arranged on asemiconductor substrate 515 b and being covered by a passivation layer507 b. Each electronic circuit 505 b, 505 b′ includes a metal plate 520b, 520 b′ and an inductor 525 b, 525 b′ that are made within thefunctional substrate 506 b. Naturally, even in this case by implementinga differential configuration the electronic circuits 505 b, 505 b′ maybe separated galvanically from each other but may remain capable ofcommunicating with each other.

An embodiment may be advantageous since it does not require the assemblyof two different electronic circuits and it does not require any furtherlayer of dielectric material; in fact, it may be possible to use atleast one oxide layer being already present in the functional substrate506 b, which acts as insulator between the metal plates 520 b, 520 b′and the inductors 525 b and 525 b′.

These and other implementations (even hybrid ones), possibly with propermodifications, may be applied to make other electronic systems thatexploit the wireless signal transmission, such as, for example, theelectronic system of FIG. 4B.

Naturally, in order to satisfy local and specific requirements, one mayapply to the embodiments described above many logical and/or physicalmodifications and alterations. More specifically, although embodimentshave been described with a certain degree of particularity, it isunderstood that various omissions, substitutions and changes in the formand details as well as other embodiments are possible. In particular,the same embodiments may even be practiced without the specific detailsset forth in the preceding description for providing a more thoroughunderstanding thereof; on the contrary, well known features may havebeen omitted or simplified in order not to obscure the description withunnecessary particulars. Moreover, it is expressly intended thatspecific elements and/or method steps described in connection with anydisclosed embodiment may be incorporated in any other embodiment as amatter of general design choice.

For example, similar considerations apply if the electronic circuitshave a different structure or include equivalent components (eitherseparated from each other or combined together, in whole or in part); inparticular, it may be possible to provide that the electronic circuitsare included in different packages.

Similar considerations may apply if the second metal plate is formed bydistinct metal plates, each one being coupled with different electroniccircuits or different functional blocks of a same electronic circuit.

Nothing prevents coupling the first metal plate with different inductors(for example, being connected to each other through series, parallel, T,or Y connections, and/or through any other useful possible combinationthereof) for creating multiple resonant channels with differentelectronic circuits and/or with different functional blocks of a sameelectronic circuit. In this case, each resonant channel will turn out tobe active in correspondence to a signal having the specific resonancefrequency for the given channel.

The same considerations may apply if at least partly variable inductorsand/or capacitors are used for properly modifying the resonancefrequencies, for example, for compensating any fluctuations in theresonant frequencies being due to parasitic effects or productionimperfections. Proper circuits, some of which may be, for example,gyrators (possibly similar to the Antoniou circuit), may be used foremulating a variable inductance, such as being capable of maximizing thesystem performance according to at least one electrical parameter beingmeasured by such circuits. Instead of changing the inductance, suitablecircuits (for example, a programmable frequency oscillator) may be usedfor varying the frequency according to the resonant circuit and theimperfections thereof, thereby allowing maximizing the transmitted powerthrough proper adaptive algorithms being applied by control circuitsthat measure at least one parameter of the transmitted and receivedsignal. At high-frequency the generic inductor may be replaced by aproper transmission line whose effect and functionality are, however,equivalent thereto.

Nothing prevents forming the first metal plate by a plurality of metalplates, each one being coupled, through a corresponding plurality ofinductors, with a corresponding plurality of electronic circuits orfunctional blocks of a same electronic circuit.

Similar considerations may apply if the metal plates have shapes beingoptimized as a function of their area occupation, such as, for example,rhomboidal ones, or if the metal plates are not plane and parallel, but,for example, coaxial cylindrical or concentric spherical ones.

Moreover, nothing prevents making the first capacitive plate insideand/or outside the coils of the inductor of a metal that, at theresonance frequency, has ferromagnetic properties (for example, magneticpermeability greater than 10), such as, for example, nickel and itsalloys or cobalt and its alloys, in order to increase the inductance ofthe inductor.

Nothing prevents making the resonant LC circuit (or part thereof) withinthe passivation layer or below it; moreover, nothing prevents making theresonant LC circuit (or part thereof) within an oxide layer or ofanother material.

The same considerations may apply if the dielectric layer between thefirst metal plate and the second metal plate is not present, forexample, by exploiting a fluid (for example, the air) being interposedbetween the two plates as dielectric

The same considerations may apply if the conductive particles are notwithin the layer of dielectric material but in the passivation layer(for example, in case that, in order to reduce the area occupation,there becomes necessary to remove the layer of dielectric material andto use the existing passivation layer as dielectric).

Moreover, the same considerations may apply if the first capacitiveplate and the second capacitive plate have a more complex profile, suchas sawtooth-like.

Nothing prevents having the capacitive plates not around the respectiveinductors, but, for example, only within them.

Similar considerations may apply if the electronic circuits are providedwith further metal plates to be used, for example, in dummy mode forobtaining a mechanical self-alignment of the first and second metalplates.

Furthermore, in all the described embodiments wherein it is desired toperform the simultaneous transmission of signals among multiple circuitsin different modes (i.e., capacitively and inductively), such atransmission may be implemented in different ways according tocorresponding specific requirements. For example, alternatively to thepossibility (previously described) of using the signal at approximatelythe resonant frequency to be transmitted both capacitively andinductively, the signal may spread over a frequency range around theresonant frequency; in this way, each frequency of the range may beproperly used for a corresponding transmission, as a sort of “dedicatedcommunication channel”. Additionally or alternatively, it may also bepossible to provide the use of different signals to be transmitted in analternated way with respect to each other, for example, by using asignal for a capacitive transmission with a corresponding circuitfollowed by another signal for an inductive transmission to anothercorresponding circuit (or vice versa). Also for the latter case, thefrequencies of the alternated signals may be approximately equal to eachother (and approximately equal to the resonant frequency) or differentto each other (but however within a proper frequency range around theresonant frequency for avoiding any excessive loss of intensity of thetransmitted signal).

The proposed embodiments might be part of the design of an integratedcircuit. The design may also be created in a programming language;moreover, if the designer does not fabricate chips or masks, the designmay be transmitted by physical means to others. In any case, theresulting integrated circuit may be distributed by its manufacturer inraw wafer form, as a bare die, or in packages. Moreover, the proposedembodiments may be integrated with other circuits in the same chip, orit may be implemented in intermediate products, such as PCBs (PrintedCircuit Boards) or on a generic substrate (for example, of the ceramictype), and coupled with one or more other chips (such as a processor ora memory). In any case, the integrated circuit may be suitable to beused in complex systems (such as computers).

In addition, the metal plate and/or the inductor may also be madeoutside the integrated circuit—for example, on a PCB or on a genericsubstrate (for example, of the ceramic type), together with the possibledielectric layer either including or not metal particles. For example,this may be useful for creating interfaces for the test of the describedelectronic circuits.

The proposed structure may be part of the design of an integratedsystem. The design may also be created in a programming language;moreover, if the designer does not manufacture the electronic system orthe masks, the design may be transmitted by physical means to others. Inany case, the resulting integrated system may be distributed by itsmanufacturer in raw wafer form, as a bare die, or in packages. Moreover,the proposed structure may be integrated with other circuits and in thesame chip, or it may be mounted in intermediate products (such as motherboards) and coupled with one or more other chips (such as a processor).In any case, the integrated system may be suitable to be used in complexsystems (such as automotive applications or microcontrollers).

Moreover, embodiments of the described electronic circuits may beimplemented and sold separately.

Furthermore, an embodiment may lend itself to be implemented through anequivalent method (by using similar steps, removing some steps being notessential, or adding further optional steps); moreover, the steps may beperformed in a different order than discussed above, concurrently, or inan interleaved way (at least partly).

From the foregoing it will be appreciated that, although specificembodiments have been described herein for purposes of illustration,various modifications may be made without deviating from the spirit andscope of the disclosure. Furthermore, where an alternative is disclosedfor a particular embodiment, this alternative may also apply to otherembodiments even if not specifically stated.

1. An electronic system including a first electronic circuit and asecond electronic circuit, a resonant LC circuit having a resonancefrequency for coupling the first electronic circuit and the secondelectronic circuit, each electronic circuit including functional meansfor providing a signal at the resonance frequency to be transmitted tothe other electronic circuit through the LC circuit, wherein the LCcircuit includes capacitor means having at least one first capacitorplate included in the first electronic circuit and at least one secondcapacitor plate included in the second electronic circuit, firstinductor means included in the first electronic circuit, the at leastone capacitor plate of the first electronic circuit being coupled withthe corresponding functional means through the inductor means.
 2. Theelectronic system according to claim 1, wherein the first electroniccircuit is integrated in a first chip and the second electronic circuitis integrated in a second chip distinct from the first chip, and whereinthe inductor means and the capacitor means of each electronic circuitare integrated in the corresponding chip and/or included in a packageembedding the corresponding chip.
 3. The electronic system according toclaim 1, wherein the first electronic circuit and the second electroniccircuit are integrated in a first region and a second region,respectively, of a common chip, the first region being insulated fromthe second region.
 4. The electronic system according to claim 1,further including at least one dielectric layer arranged between the atleast one first capacitor plate and the at least one second capacitorplate.
 5. The electronic system according to claim 1, wherein the atleast one dielectric layer embeds conductive particles.
 6. Theelectronic system according to claim 1, wherein at least one capacitorplate includes a conductive longitudinal strip, and a plurality ofconductive transversal strips extending from the longitudinal strip. 7.The electronic system according to claim 1, wherein at least onecapacitor plate has a non-planar structure with a plurality ofdepressions.
 8. The electronic system according to claim 1, wherein atleast one capacitor plate extends around the corresponding inductormeans in plan view.
 9. The electronic system according to claim 1,wherein each electronic circuit includes the corresponding inductormeans and further functional means for providing a further signal at afurther frequency to be transmitted to the other electronic circuitand/or for receiving the further signal from the other electroniccircuit, the further functional means being coupled with thecorresponding inductor means for transmitting and/or receiving thefurther signal to the inductor means of the other electronic circuit byelectromagnetic coupling, the further frequency being equal to ordifferent from the resonance frequency.
 10. The electronic systemaccording to claim 1, wherein at least one first capacitor plate has aconvex profile matching a concave profile of a corresponding secondcapacitor plate.
 11. (canceled)
 12. (canceled)
 13. A method fortransmitting signals in an electronic system from a first electroniccircuit to a second electronic circuit, wherein the method includes thesteps of: coupling the first electronic circuit and the secondelectronic circuit through a resonant LC circuit having a resonancefrequency, transmitting a signal at the resonance frequency from thefirst electronic circuit to the second electronic circuit through the LCcircuit, and wherein the step of coupling the first electronic circuitand the second electronic circuit through a resonant LC circuitincludes: coupling at least one first capacitor plate included in thefirst electronic circuit and at least one second capacitor plateincluded in the second electronic circuit to form capacitor means, thecapacitor means with first inductor means included in the firstelectronic circuit and/or second inductor means included in the secondelectronic circuit forming the LC circuit.
 14. An electronic systemincluding a first electronic circuit and a second electronic circuit, aresonant LC circuit having a resonance frequency for coupling the firstelectronic circuit and the second electronic circuit, each electroniccircuit including functional means for receiving a signal at theresonance frequency from the other electronic circuit through the LCcircuit, wherein the LC circuit includes capacitor means having at leastone first capacitor plate included in the first electronic circuit andat least one second capacitor plate included in the second electroniccircuit, first inductor means included in the first electronic circuit,the at least one capacitor plate of the first electronic circuit beingcoupled with the corresponding functional means through the inductormeans.
 15. An apparatus, comprising: a first electronic circuit having afirst signal node; and a first conductive electrode coupled to the firstsignal node and operable to form a first capacitor with a secondconductive electrode that is coupled to a second signal node of a secondelectronic circuit such that a first signal may propagate between thefirst and second signal nodes via the capacitor.
 16. The apparatus ofclaim 15, further comprising an inductor serially coupled between thefirst signal node and the first conductive electrode.
 17. The apparatusof claim 15, further comprising: wherein the first electronic circuithas a third signal node; and a third conductive electrode coupled to thethird signal node and operable to form a second capacitor with a fourthconductive electrode that is coupled to a fourth signal node of thesecond electronic circuit such that a second signal may propagatebetween the third and fourth signal nodes via the second capacitor. 18.The apparatus of claim 17, further comprising an inductor seriallycoupled between the third signal node and the third conductiveelectrode.
 19. The apparatus of claim 15 wherein the first conductiveelectrode comprises an interdigitated electrode.
 20. The apparatus ofclaim 15 wherein the first conductive electrode is nonplanar.
 21. Theapparatus of claim 15 wherein the first conductive electrode is disposedwithin at least one trench.
 22. The apparatus of claim 15, furthercomprising a dielectric disposed adjacent to the first conductiveelectrode.
 23. The apparatus of claim 15, further comprising adielectric disposed adjacent to the first conductive electrode, thedielectric including at least one electrically conductive particle. 24.The apparatus of claim 15, further comprising: a substrate; and whereinthe first conductive electrode protrudes from the substrate.
 25. Theapparatus of claim 15, further comprising: an inductor serially coupledbetween the first signal node and the first conductive electrode;wherein the inductor includes a winding; and wherein the firstconductive electrode is disposed over the winding.
 26. The apparatus ofclaim 15, further comprising: an inductor serially coupled between thefirst signal node and the first conductive electrode; wherein theinductor includes a winding; and wherein the first conductive electrodeis disposed adjacent to the winding.
 27. The apparatus of claim 15,further comprising: an inductor serially coupled between the firstsignal node and the first conductive electrode; wherein the inductorincludes a winding having turns; and wherein the first conductiveelectrode includes a portion disposed between the turns of the winding.28. The apparatus of claim 15, further comprising: an inductor seriallycoupled between the first signal node and the first conductiveelectrode; and wherein the first conductive electrode includes a portionthat is disposed around the inductor.
 29. The apparatus of claim 15,further comprising: an inductor serially coupled between the firstsignal node and the first conductive electrode; and wherein the firstconductive electrode includes a portion that is disposed around theinductor.
 30. The apparatus of claim 15, further comprising: an inductorserially coupled between the first signal node and the first conductiveelectrode and disposed around a portion of the first conductiveelectrode.
 31. The apparatus of claim 15, further comprising: aferromagnetic material; and an inductor serially coupled between thefirst signal node and the first conductive electrode and having aportion disposed around the ferromagnetic material.
 32. The apparatus ofclaim 15, further comprising: a semiconductor die; and wherein the firstelectronic circuit and the first conductive electrode are disposed onthe die.
 33. The apparatus of claim 15, further comprising: a substrate;and wherein the first electronic circuit and the first conductiveelectrode are disposed on the substrate.
 34. A system, comprising: afirst apparatus including a first electronic circuit having a firstsignal node; a first conductive electrode electrically coupled to thefirst signal node; and a first inductor serially coupled between thefirst signal node and the first conductive electrode; and a secondapparatus including a second electronic circuit having a second signalnode; and a second conductive electrode electronically coupled to thesecond signal node and forming a first capacitor with the firstconductive electrode.
 35. The system of claim 34 wherein the secondapparatus further includes a second inductor serially coupled betweenthe second signal node and the second conductive electrode.
 36. Thesystem of claim 34 wherein the second apparatus further includes asecond inductor serially coupled between the second signal node and thesecond conductive electrode and magnetically coupled to the firstinductor.
 37. The system of claim 34 wherein: the second electroniccircuit further includes a third signal node; and the second apparatusfurther includes a second inductor electrically coupled to the thirdsignal node and magnetically coupled to the first inductor.
 38. Thesystem of claim 34 wherein the first and second apparatuses are disposedon a same integrated-circuit die.
 39. The system of claim 34 wherein thefirst and second apparatuses are disposed on respectiveintegrated-circuit dies.
 40. The system of claim 34 wherein the firstand second apparatuses are disposed on a same substrate.
 41. The systemof claim 40 wherein the substrate comprises a semiconductor substrate.42. The system of claim 40 wherein the substrate comprises a printedcircuit board.
 43. The system of claim 34 wherein the first and secondapparatuses are disposed on respective substrates.
 44. The system ofclaim 34 wherein: the first apparatus further includes the firstelectronic circuit having a third signal node; a third conductiveelectrode electrically coupled to the third signal node; and the secondapparatus further includes the second electronic circuit having a fourthsignal node; and a fourth conductive electrode electronically coupled tothe fourth signal node and forming a second capacitor with the thirdconductive electrode.
 45. The system of claim 44 wherein the firstapparatus further includes a second inductor serially coupled betweenthe third signal node and the third conductive electrode.
 46. The systemof claim 44 wherein the second apparatus further includes a secondinductor serially coupled between the fourth signal node and the fourthconductive electrode.
 47. A method, comprising: conducting a firstsignal having a first frequency with a first inductor and a firstconductive electrode; capacitively coupling the signal between the firstconductive electrode and a second conductive electrode that forms acapacitor with the first conductive electrode, a resonant frequencycorresponding to a combination of the inductor and the capacitor beingapproximately equal to the frequency of the signal.
 48. The method ofclaim 47, further comprising: generating the signal with a first circuitthat is disposed on first platform with, and that is electricallycoupled to, the inductor and first conductive electrode; and receivingthe signal with a second circuit that is disposed on a second platformwith, and that is electrically coupled to, the second conductiveelectrode.
 49. The method of claim 47, further comprising: generatingthe signal with a first circuit that is disposed on a first platformwith, and that is electrically coupled to, the second conductiveelectrode; and receiving the signal with a second circuit that isdisposed on a second platform with, and that is electrically coupled to,the inductor and first conductive electrode.
 50. The method of claim 47wherein conducting the signal comprises conducting the signal with aseries combination of the inductor and the first conductive electrode.51. The method of claim 47, further comprising magnetically coupling thesignal from the first inductor to a second inductor that is electricallycoupled to the second conductive electrode, the resonant frequencycorresponding to a combination of the first and second inductors and thecapacitor being approximately equal to the frequency of the signal. 52.The method of claim 47, further comprising magnetically coupling thesignal from the first inductor to a second inductor that is electricallyuncoupled from the second conductive electrode.
 53. The method of claim47, further comprising: conducting a second signal having a secondfrequency with a second inductor and a third conductive electrode; andcapacitively coupling the second signal between the third conductiveelectrode and a fourth conductive electrode that forms a secondcapacitor with the third conductive electrode, a second resonantfrequency corresponding to a combination of the second inductor and thesecond capacitor being approximately equal to the second frequency ofthe second signal.
 54. An apparatus, comprising: a first electroniccircuit having a first signal node; an inductor having a first nodecoupled to the signal node and having a second node; and a firstconductive electrode coupled to the second node of the inductor andoperable to form a first capacitor with a second conductive electrodethat is coupled to a second signal node of a second electronic circuitsuch that a first signal may propagate between the first and secondsignal nodes via the inductor and capacitor.
 55. An apparatus,comprising: a first electronic circuit having first and second signalnodes; a first conductive electrode coupled to the first signal node andoperable to form a first capacitor with a second conductive electrodethat is coupled to a third signal node of a second electronic circuitsuch that a first signal may propagate between the first and thirdsignal nodes via the first capacitor; an inductor having a first nodecoupled to the second signal node and having a second node; and a thirdconductive electrode coupled to the second node of the inductor andoperable to form a second capacitor with a fourth conductive electrodethat is coupled to a fourth signal node of the second electronic circuitsuch that a second signal may propagate between the third and fourthsignal nodes via the inductor and the second capacitor.